By Vojin G. Oklobdzija

ISBN-10: 0849386020

ISBN-13: 9780849386022

In line with large development and new applied sciences within the semiconductor undefined, this quantity is prepared into 5, information-rich sections. electronic layout and Fabrication surveys the newest advances in machine structure and layout in addition to the applied sciences used to fabricate and attempt them. that includes contributions from prime specialists, the e-book additionally features a new part on reminiscence and garage as well as a brand new bankruptcy on nonvolatile reminiscence applied sciences. constructing complicated strategies, this sharply concentrated e-book: * Describes new applied sciences that experience turn into using elements for the digital undefined * contains new details on semiconductor reminiscence circuits, whose improvement most sensible illustrates the outstanding growth encountered by way of the fabrication and expertise zone * incorporates a part devoted to matters with regards to process energy intake * Describes reliability and testability of computers * Pinpoints tendencies and state of the art advances in fabrication and CMOS applied sciences * Describes functionality evaluate measures, that are the base line from the user’s viewpoint * Discusses layout innovations used to create sleek desktops, together with high-speed laptop mathematics and high-frequency layout, timing and clocking, and PLL and DLL layout

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The problem of the low energy doping is lower retain dose and lower activation rate of the implanted species [48]. As the activation method, high temperature spike lamp anneal [48] is the best way at this moment. In order to suppress the diffusion of the dopant, and to keep the over-saturated activation of the dopant, the spike should be as steep as possible. Laser anneal [50] can realize very high activation, but very high temperature above the melting point at the silicon surface is a concern.

1960. 2. SIA, EECA, EIAJ, KSIA, and TSIA, ‘‘International Technology Road Map for Semiconductors,’’ in 1999 edition. 3. H. H. -N. L. Rideout, E. R. LeBlanc, ‘‘Design of ion-implanted MOSFET’s with very small physical dimensions,’’ IEEE J. Solid-State Circuits, SC-9, pp. 256–268, 1974. 4. M. Ono, M. Saito, T. Yoshitomi, C. Fiegna, T. Ohguro, and H. Iwai, ‘‘Sub-50 nm gate length n-MOSFETs with 10 nm phosphorus source and drain junctions,’’ IEDM Tech. , pp. 119–122, December, 1993. 5. S. Momose, M.

637–640, 2000. 2007 5:06pm Compositor Name: VBalamugundan Trends and Projections for the Future of Scaling and Future Integration Trends 1-31 47. K. Matsuo, T. Saito, A. Yagishita, T. Iinuma, A. Murakoshi, K. Nakajima, S. Omoto, and K. Suguro, ‘‘Damascene metal gate MOSFETs with Co silicided source=drain and high-k gate dielectrics,’’ Symp. on VLSI Tech. Dig. , pp. 70–71, 2000. 48. F. B. W. Falk, ‘‘Doping and annealing requirements to satisfy the 100 nm technology node,’’ Proc. ECS Symp. on Advances in Rapid Thermal Processing, vol.

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Digital Design and Fabrication by Vojin G. Oklobdzija

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